WHAT’S NEW
We all understand that higher circuit density and increasingly compact microelectronic devices have created a need for more efficient cooling. Vapor chambers have emerged as a widely employed solution in some of the most demanding microelectronics applications. They are already […]
Lance Dumigan Fabrisonic, LLC Mark Norfolk Fabrisonic, LLC Practical Knowledge Gained “The performance of DTC cold plates can be enhanced by a new method of fabrication called Ultrasonic Additive Manufacturing (UAM). Building DTC cold plates with UAM could enhance […]
Rjc (or sometimes ThetaJC, θjc, Rth_jc), the so-called ‘junction to case’ thermal resistance, is a thermal metric that enables comparison of the thermal performance of packaged semiconductor devices from differing suppliers. The JEDEC standard JESD51-14 [1] documents a method for […]
Thermocouples are widely used for temperature measurements. They are particularly useful in lab testing, due to their relatively low cost and the ability to easily fabricate thermocouples of specific lengths for a given test. This Tech Brief discusses issues related […]
By: Marta Rencz, Andras Poppe, and Genevieve Martin The 29th issue of the THERMINIC (Thermal investigations of ICs and Systems) workshops was held on 27-29 September 2023 in Budapest, Hungary at the Budapest Marriott Hotel. Over 110 participants enjoyed the […]
The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the JW Marriott Grande Lakes, Orlando, FL, May 30 – June 2, 2023. This was the 22nd ITherm, which was first held in 1988. […]
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