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Carbon-Based Passive Thermal Management Material

March 9, 2012 Electronics Cooling New Products, TIMs carbon-based, Thermal Diffusivity, thermal expansion, Thermal Management

Applied Nanotech’s new passive thermal management material, CarbAl™, is a carbon-based material with a unique combination of low density, high thermal diffusivity, and low coefficient of thermal expansion.

CarbAl™ has a density of 1.75 g/cm³compared to 2.7 g/cm³for aluminum and 8.9 g/cm³for copper. While copper has a slightly higher thermal conductivity than CarbAl™, 390 W/mK compared to 350 W/mK, CarbAl’s thermal diffusivity is approximately 2.9 cm²/sec compared to 0.84 cm²/sec for aluminum and 1.12 cm²/sec for copper.

Learn more from Applied Nanotech.

About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

About the Author

Electronics Cooling

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