This blog summarizes some of the recent findings from an ongoing project “An In-Depth Understanding of Oil Immersion Cooling Strategies for Data Centers” at the University of Texas at Arlington (UTA). This project is supported by NSF I/UCRC grant in the program “Energy-Smart Electronic Systems” (ES2) and by many industry partners. Complete immersion of servers in … [Read more...]
A Brief Overview of Thermal Management in Printed Electronics
Editor’s Note: This is the first in a series of articles to appear in Electronics Cooling addressing emerging areas for electronics thermal management. Printed electronics (PE) is one of the key enabling technologies of many electronic products that we take for granted today, not just in functional feasibility but also in cost that seems to be on a continuous downward trend. … [Read more...]
Ultra Low Thermal Resistant Adhesives for Electronic Applications
Sponsored by Master Bond As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability. As product manufacturers face greater challenges adhesives are uniquely qualified to meet … [Read more...]
SEMI-THERM 33 2017 Exhibits Highlights – Part 2
Editor’s Note: This is the 2nd of a two-part summary from SEMI-THERM 33. Click here for Part 1. SEMI-THERM 33 concluded last week at Silicon Valley, CA and Electronics Cooling was the only media and content provider present on the exhibit floor. We take this opportunity to thank our readers and contributors who stopped by our booth to learn about our plans for this year … [Read more...]
Recent Research in TIMs
Please find below some recent research in Thermal Interface Materials (TIMs). Low melting alloy composites as thermal interface materials with low thermal resistance Haoran Wen, Yaqiang Ji Kai Zhang, Matthew M.F. Yuen, S.W. Ricky Lee, Xian-Zhu Fu, Rong Sun & Ching-Ping Wong Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal … [Read more...]
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