Electronics Cooling’s previous coverage of thermoregulation fabrics is further augmented by a very encouraging trend seen at the recent Wearables USA Conference held last week in Silicon Valley, CA. More than half a dozen companies showcased product design platforms that enable OEMs (original equipment manufacturers), ODMs (original device manufacturers), and makers alike to … [Read more...]
SDP-5040-A/B Gap Fillers To Advance Thermal Management Applications
In and effort to increase the options available to thermal engineers in the growing market for silicone TIM (Thermal Interface Materials), Shin-Etsu Silicones of America, Inc. (SESA: A U.S. subsidiary of Shin-Etsu Chemical Co. Ltd., Japan) recently premiered its SDP-5040-A/B Gap Filler product. The non-adhesive product is part of the high performing SDP Series which are Two … [Read more...]
New Liquid Cooled Amplifiers
AR, the world leader in supplying high power, broadband amplifiers, can now supply chillers for any of its standard liquid-to-liquid cooled amplifiers. This capability ensures amplifier performance in any operating condition, reduces the risk of inappropriately sized equipment, and eases the procurement process by working with only one vendor. Each chiller is sized for the … [Read more...]
University of Toronto Selects CoolIT Systems to Liquid Cool Signal Processor for CHIME Project
Calgary, AB. November 10, 2016 – CoolIT Systems, the world leader in energy efficient liquid cooling solutions for the HPC, Cloud and Enterprise markets, has been selected by the University of Toronto to provide custom liquid cooling for its new signal processing backend which will support Canada’s largest radio telescope, the Canadian Hydrogen Intensity Mapping Experiment … [Read more...]
Cooling Technology Enables Fashion-Tech Wearable Products
In one of our previous blogs on Electronics Cooling of Humans, we highlighted some of the on-going research projects at various universities in the US sponsored by ARPA-E. These projects are expected to achieve a step-change in the cooling technology of wearable fabrics and the costs of manufacturing them. It is worth noting that prior to the effort sponsored by ARPA-E, thermal … [Read more...]
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