The Armed Forces Communications and Electronics Association (AFCEA International) has reduced its physical and carbon footprint by transitioning its data center infrastructure into a virtualized environment. The consolidation cut AFCEA’s data center from 12 servers to two principal servers and two backup servers. The streamlined operations reduced both energy consumption and … [Read more...]
Group Launches Revision of Board Mounted Power Supplies Guideline
The High Density Packaging (HDP) User Group recently launched its second edition of Board Mounted Power Supply (BMPS) Application Guidelines. First, launched in March 2007, it was designed to support the communications and electronics manufacturing industry by promoting better understanding of BMPS products. Since then major users and manufacturers of BMPS products, have … [Read more...]
This Week ONLY Enter to WIN an iPod Nano!
We are offering ElectronicsCooling readers the opportunity to win a NEW iPod Nano! All you need to do is answer a five-question survey that will help us provide you, the reader, with content that is valuable and truly practicable to you. Entries accepted until 5 pm EST Friday, November 12, 2010. We will notify the winner via email on Monday, November 15, 2010. Enter to win … [Read more...]
Temperature/Humidity Sensor Helps Protect Telecom Electronics
Temperature@lert recently released its latest sensor offering, a probe that monitors both temperature and humidity in one small device. When Google or Microsoft or IBM put in a new data center, environmental monitoring is a significant piece of the enterprise security and monitoring system incorporated into the facility. By monitoring environmental conditions such as … [Read more...]
Analysis System Ensures Optimal Heat Sink Efficiency
The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and semiconductor. With Tactilus, engineers can visualize actual contact forces and pressure distribution data on the circuit board components. As the mounting … [Read more...]
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