Introduction Control of component temperatures and temperature gradients is essential for the successful operation and reliability of electronics products [1]. However, conventional cooling methods, such as natural convection or fan-induced air-cooling, cannot cope with the increasing demand for electronics cooling. Therefore, more sophisticated cooling techniques are required. … [Read more...]
Micropumping Technologies for Electronics Cooling
Introduction Traditional cooling approaches, consisting typically of external air-cooled heat sinks, are increasingly falling short in meeting the thermal management challenges of emerging electronic systems. Integrated cooling designs are being investigated to eliminate some of the interface contact resistances introduced by add-on heat sinking and to minimize package … [Read more...]
Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks
Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today's electronics. In these design situations, the proven method of analytical calculations, modeling, and laboratory testing is sometimes bypassed in the search for a quick "cure-all" solution. Evolutionary progress is … [Read more...]
Thermal Design And NEBS Compliance
Introduction As part of contractual and design requirements, telecom equipment destined for certain networks in the North American market has to be tested to the Network Equipment Building System (NEBS) standard and comply with its requirements. NEBS is a standard from Telcordia, formerly known as Bell Communication Research (Bellcore). Technically speaking, NEBS is the … [Read more...]
Thermal Conductivity of III-V Semiconductors
Silicon dominates the electronics industry as the semiconductor of choice for most applications, but some electrical functions require electronic properties different from those of silicon. A grouping of semiconductors termed "III-V" have desirable electrical properties for applications such as microwave integrated circuits, light emitting diodes and laser diodes. Some of the … [Read more...]
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