The big electronics design show was in town. Gino suggested we blow off work for the day and check it out. I was a little short on promotional pens and key chains, so I fell in with him. Gino is OK, even if he's one of those Reliability Engineers. The cavernous convention center was packed with flashy booths of the usual component, CAD-tool and test equipment vendors. It's … [Read more...]
Thermal Interface Materials: A Brief Review of Design Characteristics and Materials
Introduction In the past few decades, as microprocessors have continued to evolve along Moore's law, providing increased functionality and performance, there has been an associated increase in cooling demand driven both by the increase in raw power and in local power densities on the die, commonly referred to as "hot spots"[1, 2]. Considerable attention has therefore been given … [Read more...]
The Temperature Ratings Of Electronic Parts
Introduction Semiconductor parts are most often specified for use in the "commercial" 0 to 70°C and, to a lesser extent, in the "industrial" -40 to 85°C operating temperature range. These operating temperature ratings generally satisfy the demands of the dominant semiconductor customers in the computer, telecommunications, and consumer electronic industries. There is also a … [Read more...]
The Benefits Of Using Hadiabatic In Thinking About Electronics Cooling
The heat transfer coefficient is used to describe convective heat transfer between a solid and a fluid, as in Equation (1). The heat transfer coefficient is a defined parameter, not a physical property like thermal conductivity, and different definitions are used for different situations. The preferred definition for use in the electronics-cooling situation is … [Read more...]
Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance
In past issues of Electronics Cooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by the fan is forced to go through the channels formed between the fins. As noted in the second article this is often not the case and much of the … [Read more...]
- « Previous Page
- 1
- …
- 136
- 137
- 138
- 139
- 140
- …
- 176
- Next Page »