Thermal design engineers working in defense electronics are facing many challenges, some of which have been around for a long time and some that are more recent. Worldwide climatic extreme temperatures are reasonably constant and there are many military electronic systems that function in these extremes. As a result, there is significant design history available for … [Read more...]
A Few Design Techniques On How To Reduce The Power
There will always be the need to get heat out of high power circuitry, but with a little extra design effort up front, we may be able to reduce overall power needs. Here are two techniques that can help do that. Turn Idle Circuits Off A circuit that is not always used can be turned off until needed. This is a technique widely used in battery powered electronics, but it can be … [Read more...]
Power Density Challenges Of Next Generation Telecommunication Networks
Despite the current downturn in the telecommunications industry, data transfer (i.e. network traffic) is continuing to grow at a 100% rate [1]. It is already projected that network traffic demand will reach tens of Tb/s in a couple of years from now (see predicted traffic demands from telecommunications analysts Ryan, Hankin & Kent, Figure 1). At the same time, network … [Read more...]
Packaging And Temperature Control Considerations For Planar Waveguide Circuits
Optical Networking The all-optical network has been emerging as a solution to provide higher bandwidth, lower cost systems for handling high capacity network traffic. Due to the inherent limits of copper wire and the high cost-per-bit of electrical systems, service providers will replace electrical components with fiber optic counterparts wherever possible as the cost of the … [Read more...]
Optical Measurement Of Flip-Chip Package Warpage And Its Effect On Thermal Interfaces
Warpage of FC-PBGA Packages Flip chip technology has emerged as an important chip-level package solution to meet the ever-increasing demand of high I/O requirements. The flip chip technology was implemented originally for a multi-layer ceramic substrate. In the ceramic flip chip package, a shear strain in each bump, produced by the mismatch of the coefficient of thermal … [Read more...]
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