by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Prior to designing the requisite thermal management solution, engineers routinely calculate the junction temperatures of active and passive components using various methods at their disposal –finite difference grids, lumped parameter models, finite element methods, etc. The junction … [Read more...]
Comparison of Heatsinks used for the Thermal Management of LEDs
By James Pryde1,2, Weeratunge Malalasekera1, and David Whalley1 1Loughborough University 2Tamlite Lighting Introduction The work of Kraus & Bar-Cohen [1] and Bar-Cohen et al. [2] provide a well-defined foundation for the design and optimisation of conventional heatsinks. However, advances in manufacturing processes and increasing access to simulation tools provide new … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
Thermal Conductivity & CTE of Materials: Can We Engineer Them?
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Most electronics cooling problems are not just limited to the computation of temperatures at various points and the design remedies thereof. They also extend to managing the collateral effects of temperature fluctuations. One such effect is the mobilization of thermomechanical stresses in … [Read more...]
Design Considerations When Using Heat Pipes
By George Meyer, Celsia Inc. Introduction This article is intended to offer design guidance when using heat pipes for the most prevalent types of electronics applications: mobile to embedded computing and server type applications with power dissipation ranging from 15 W to 150 W using processor die sizes between 10 mm and 30 mm square. Discussion is constrained to those … [Read more...]
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