SEPTEMBER 5TH, 2014 https://test.electronics-cooling.com:80/2014/09/top-10-flotherm-v10-features-11-odds-sods/ A release so good it has 11 best top 10 features, very Spinal Tap. I thought I’d wrap up this series with a list of more minor, but IMO, very useful features and finish off with some words on cultural idioms. FloTHERM V10.0 and V10.1 together satisfy … [Read more...]
Top 10 FloTHERM V10 Features – #4: Updated CAD
FloTHERM's strength has always its been its robustness, founded on a simplicity of technology that we've tried not to compromise over its 25 year life. This is no truer than in its 3D CAD drawing interface. More Lego than Sculpting in its capabilities, it's always been quick and easy to mock up a conceptual cooling architecture for a proposed design. FloTHERM V10 provides a … [Read more...]
Top 10 FloTHERM V10 Features – #3: FEA Interfacing
Temperature has always been, and will continue to be, a good enough leading indicator of product reliability. As a parameter it is easy to specify a maximum rating value and relatively easy to measure. However it is not temperature itself that directly causes product failure, more often than not it is some kind of mechanical fracture or deformation that itself is fuelled by … [Read more...]
Thermal Facts and Fairy Tales: Historical Suggestions for Thermal Management of Electronics
Jim Wilson, Engineering Fellow Raytheon Company I have a small book in my office labeled “Suggestions for Designers of Navy Electronic Equipment, 1970 Edition” that was given to me several years ago by the editor at microwaves101.com (which happens to be a useful website if you are interested in microwave topics). The introduction states that any or all of this information is … [Read more...]
Built-in Heat Spreading for Efficient Thermoelectric Cooling of Concentrated Heat Loads
Jeff Hershberger, Robert Smythe, Xiaoyi Gu and Richard F. Hill Laird Technologies, Inc. INTRODUCTION Thermoelectric cooling is an active thermal management technique. A thermoelectric cooler (TEC) has two circuit boards which are typically Al2O3 plates with copper circuit traces attached to them and semiconductor elements soldered between them. TECs are now available … [Read more...]
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