Wendy Luiten Philips Research, Eindhoven, the Netherlands INTRODUCTION Active LEDs in a consumer TV product are boosted and dimmed with the video picture content. Boosting and dimming of the LEDs is a powerful means to improve visual experience, either through application of active LEDs in an ambient light feature, or through dimming and boosting of the display LEDs in a … [Read more...]
Challenges in Measuring Theta jc for High Thermal Performance Packages
Jesse Galloway and Ted Okpe Amkor Technology One of the more challenging thermal resistance measurements to make for electronic packages is the junction-to-case resistance called Theta jc. The equation for Theta jc, equation (1), is straightforward. However, the difficulty lies in making an accurate case temperature, Tc, without affecting the junction temperature, Tj, and the … [Read more...]
Estimating the Thermal Interaction between Multiple Side-by-Side Chips on a Multi-Chip Package
Je-Young Chang and Ashish Gupta Intel Corporation INTRODUCTION Integration using multi-chip packaging (MCP) is an effective and popular technology option to increase transistor density in one component by integrating two or more dice or other discrete components on a common substrate. For accurate thermal analyses of MCPs, thermal interactions between active components need … [Read more...]
Electronics Cooling June 2014 Issue Now Online
Don’t miss out on the June 2014 issue of Electronics Cooling, which includes feature articles on Solder Joint Lifetime of Rapidly Cycled LED Components; Advances in Vapor Compression Electronics Cooling; Challenges in Measuring Theta jc for High Thermal Performance Packages; and more. If you would like to receive your free copy of Electronics Cooling click here to … [Read more...]
Ramping Up for THERMINIC! Abstract Deadline 28th May 2014
The first deadline for abstract submissions to the 20th IEEE Workshop on THERMAL INVESTIGATIONS OF IC’s AND SYSTEMS (THERMINIC 2014) to be held at the magnificent World Heritage Site in Greenwich, London, has now passed. We’ve had a great response to the first call for abstracts, with more abstracts submitted this year compared to last year. The quality of abstracts submitted … [Read more...]
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