INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices. As this energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]
Ultra-Thin Titanium Based Thermal Solution for Electronic Applications
Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design of thermal engineering and heat rejection technologies. The need for performance inevitably leads to operation of most … [Read more...]
Bitcoin 2-Phase Immersion Cooling and the Implications for High Performance Computing
Alex Kampl Allied Control Company Abstract Recently, Bitcoin and Bitcoin mining have aroused international interest. This article describes the cooling challenges faced by Bitcoin miners and discusses the implications on the future of cooling for supercomputers, HPC clusters and other high density electronics. We explain the inner workings of the first commercial open … [Read more...]
Potential Pitfalls of Hybrid Electrical-Thermal Measurements for Thermal Characterization
Anurag Gupta, David H. Altman, Daniel P. Resler Raytheon Integrated Defense Systems Introduction Electrical resistors are often used to simulate heat-dissipating electronic devices in thermal characterization of semiconductor devices. This article describes a study in which test measurements and analysis were conducted in steady-state conditions to characterize the thermal … [Read more...]
Electronics Cooling March 2014 Issue Now Online
Don’t miss out on the March 2014 issue of Electronics Cooling, which includes the 2014 Buyers' Guide and feature articles on Bitcoin 2-Phase Immersion Cooling and the Implications for High Performance Computing; Ultra-Thin Titanium Based Thermal Solution for Electronic Applications; Potential Pitfalls of Hybrid Electrical-Thermal Measurements for Thermal Characterization; and … [Read more...]
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