Bruce Guenin, Assoc. Editor, Electronics Cooling View Part 1 here. Introduction This two-part column was motivated by concerns regarding the important role of organic materials in electronic systems and their accompanying vulnerabilities due to moisture diffusion. The methods described herein are intended to provide an efficient means of predicting the rate of moisture … [Read more...]
Electronics Cooling 2013 Buyers’ Guide Issue Now Online
Don’t miss out on the March 2013 issue of Electronics Cooling, which includes the 2013 Buyers’ Guide, feature articles on Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, Measuring and Predicting Junction Temperature: Thermal Factors Influencing Reliability in GaN HEMTs, … [Read more...]
Experiment vs. Simulation, Part 3: JESD51-14
The JESD51-14 standard was published in November 2010, prepared by the JEDEC JC-15 Committee on Thermal Characterization. It outlines a new process to measure what is the most common IC package thermal metric, Theta_jc. This is the thermal resistance between the die and the package case face. More specifically the face of the package that is to be cooled by an external … [Read more...]
Experiment vs. Simulation, Part 1: Them and Us.
Before you sell it, or commission it, you want to be sure that it works. Monies have been spent on getting things this far, some of it on you via your overhead and your expansive salary (yeh, ok, I hear you). Expectation is that your organisation will make more money back. Last thing you want is to have your product fail, have to be tweaked, fixed, respun, redesigned or canned. … [Read more...]
Editorial: An Exciting Time for Thermal Engineers
I am delighted to have the opportunity to write this editorial and follow in the footsteps of my illustrious colleagues at ElectronicsCooling, both past and present. In keeping with tradition, I would like to share some thoughts that have been on my mind recently. This is an exciting time to be a thermal engineer in the electronics industry. Our industry is experiencing … [Read more...]
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