Silicon Laboratories has introduced a new family of high-performance 8-bit microcontrollers featuring the company’s latest mixed-signal breakthrough, an integrated temperature sensor with best-in-class accuracy over an extended temperature range and without the need for calibration. It offers a mix of integrated high-performance analog peripherals and a particularly fast 8051 … [Read more...]
High Efficiency Thermoelectric Air Conditioners
TECA Corporation has introduced the AHP-4250 family of thermoelectric air conditioners. They have a cooling capacity of 3,600 BTU/HR. “Green Zone” styles have efficiencies approaching 100 percent. Both styles come standard with TECA’s eco-mode temperature control design which helps save energy by limiting the need for active cooling when it’s not needed. Like TECA’s other … [Read more...]
Electronics Cooling June Issue Now Online
Don’t miss out on the June 2012 issue of Electronics Cooling, which includes feature articles on hot spot dissipation, spray cooling , metal foam-PCM heat storage technology, and much more. If you would like to receive your free copy of Electronics Cooling click here to subscribe. Read the June 2012 issue here. Download your copy of the June 2012 issue here. … [Read more...]
Lidded Versus Bare Die Flip Chip Package: Impact on Thermal Performance
Thermal design and material selection continues to be a concern for electronic packages, particularly for flip chip ball grid array packages (FCBGA). Lower cost package options are available today, which are finding applications in high power design spaces that previously only employed copper lid heat spreaders. Exposed die flip chip packages are used frequently in lower power … [Read more...]
Spray Cooling Heat Transfer – Test and CFD Analysis
Spray cooling processes yield high heat transfer coefficients due to heat absorption associated with latent heat absorption during liquid-vapor phase transition [1-5]. Spray cooling advantages lie in potentially eliminating TIM1 and TIM 2 thermal resistances, yielding significant reduction in overall thermal resistance. Due to the complexity and chaotic nature of millions of … [Read more...]
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