"The stuff you engineers design is too good," the guy from Marketing said, "I need shoddier! Can you make them less efficient and cheaper?" I was working for a small company that made electric power conditioning equipment. Our devices protected against spikes, sags and brownouts in the AC power for mission-critical equipment like air traffic control radar and the computer … [Read more...]
Component thermal characterization
For decades, the worldwide electronics industry has produced a stream of products that continue to amaze us with their capabilities, their compactness, and their low price. This track record is due, in part, to an intricate set of interrelationships between a large number of hardware and software vendors who balance cooperative and competitive market strategies. Key elements in … [Read more...]
Don't underestimate radiation in electronic cooling
don't underestimate radiation in electronics cooling Bruce M. Guenin, Ph.D., Associate Editor, Amkor Technology, Inc. It is easy to underestimate the role of thermal radiation as a significant contributor to electronics cooling in environments without forced air flow. By its very nature it is invisible. The proper treatment of it can be intimidating due to the complicated … [Read more...]
Managing power requirements in the electronics industry
Rapid growth in the use of Internet and telecommunication services has created unique yet critical demands on the power required to energize this network. Continuing market requirements for higher-speed access - coupled with expanding needs for all modes of electronic communications - have resulted in telecommunications systems that exhibit dramatic increases in power … [Read more...]
Determining the junction temperature in a semiconductor package, part IV – localized heat generation on the die
In the standard thermal test environment, thermal test chips are designed to dissipate the applied power uniformly over most of the die surface. However, in many situations of practical interest, the power is dissipated over a localized area of the die. This column provides calculation methods to deal with the latter situation. Figure 1 illustrates the situation of interest … [Read more...]
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