Researchers at Germany’s Fraunhofer Institute of Solar Energy Systems have developed highly-porous metal organic frameworks (MOFs) that can be applied in a thin layer to efficiently absorb large quantities of water vapor. MOFs, as determined by research published in RSC Advances, are three-dimensional porous structures consisting of metallic clusters and organic linkers adept … [Read more...]
Superconducting Refrigerator Cools via Tunneling Cascade
Researchers from Italy and France have proposed a new design for a superconducting refrigerator that uses a series of steps to more effectively cool objects down to temperatures near absolute zero. Conventional superconducting refrigerators rely a array of superconductors (S), normal metals (N) and tunnel barriers (I) that are arranged in a symmetric configuration (SINIS or … [Read more...]
New Device to Cool Chips at the Micro-Scale
Researchers at the University of California, Berkeley and the University of California, San Diego have developed a novel evaporator structure that can be integrated directly into electronics to cool chips with micro-sized components. “The idea behind this project is to use liquid, in this case de-ionized water, to absorb the heat produced by any kind of device, then evaporate … [Read more...]
Thermal Adhesive Tape Reduces PCB Production Time
Universal Science, a provider of thermal management solutions, has introduced a reflowable, thermally conductive adhesive tape designed for application during PCB manufacturing. Bondline 1000-Reflow can be laminated directly to PCBs prior to processing, enabling the PCBs to be finished/ supplied with a thermally conductive, mechanical fixing tape pre-applied and thus reducing … [Read more...]
Rugged Circuit Functions at Temperatures Greater than 350 Degrees Celsius
Researchers at the University of Arkansas have developed integrated circuits capable of surviving at temperatures greater than 350 degrees Celsius, or approximately 660 degrees Fahrenheit. Created using silicon carbide, a semiconducting material that is more rugged than conventional materials used in electronics, the new circuits are expected to improve the operation of analog … [Read more...]
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