INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices. As this energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]
Self-Ventilating Heat Exchanger Cools Sealed Compartments without Contamination
AMETEK Rotron has introduced the new Discus self-ventilating heat exchanger designed to cool sealed airborne or ground-based electronic and optical compartments without introducing contaminated external air. Ideal for pod-mounted airborne optical systems, the Discus can also be used to cool other aircraft, helicopter, drone and ground-based electronics requiring air … [Read more...]
Technical Guide Offers In-Depth Product Dispensing Information
Chomerics, a division of Parker-Hannifin Corporation, has released a new thermal interface material dispensing guide. The 16-page guide contains product and in-depth technical information on the company’s range of THERM-A-GAP gels, THERM-A-FORM cure-in-place compounds and other dispensable thermal interface materials. Comprehensive advice and guidance on dispensing equipment … [Read more...]
Waste Sulfur May Improve Thermal Imaging Lenses
The discovery of a new use for waste material left over refining fossil fuels could lead to benefits for the thermal imaging industry. A University of Arizona-led international team has found that the sulfur left over from the refining process can be transformed into inexpensive, lightweight plastic lenses for infrared detection devices. "We have for the first time a polymer … [Read more...]
Polymer-Based Thermal Interface Material Cools Devices at 200°C
Scientists have developed a new polymer-based thermal interface material (TIM) capable of conducing heat 20 times better than conventional polymer. Reliable in temperatures of up to 200°C, the modified material can be fabricated on heat sinks and heat spreaders and adheres well to components in servers, LEDs and mobile devices. “Thermal management schemes can get more … [Read more...]
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