Clemens J.M. Lasance Guest Editor, Philips Research Emeritus, Consultant at SomelikeitCool I assume everybody agrees with the fact that it is pointless to devote precious space in this magazine to highlight again all problems related to thermal management of electronic products and systems, so let’s start right away. An important way of reducing the temperature in an optimal … [Read more...]
New CFD Software Update Offers Efficient Handling of Advanced Designs
Thermal simulation and analysis products supplier Mentor Graphics Corp. has released the next generation of its FloTHERM computational fluid dynamics software program with the addition of a new native Windows graphical user interface (GUI) to handle pre-processing and large models with ease for advanced electronic designs. According to the company, the new version includes a … [Read more...]
Connectors for Liquid Cooling Applications
Colder Products Company, a provider of quick disconnect couplings and fittings for plastic tubing, has released the new LQ6 series connectors. Designed specifically for liquid cooling applications requiring multiple connect and disconnect cycles, these specialized couplings deliver reliability, security and ease-of-use in cooling applications where a drip-free connection is … [Read more...]
Heat Sink Watch Helps Wearer Manage Body Temperature
Four engineering students at MIT have developed a thermoelectric bracelet designed to help wearers maintain a comfortable body temperature. Resembling a wristwatch, the invention, known as Wristify, monitors air and skin temperature and sends pulses of hot or cold waveforms to the wrist when needed to help the wearer maintain thermal comfort. A custom copper-alloy-based heat … [Read more...]
Defense Contractors to Develop Next-Gen Military Electronics Thermal Management
U.S. Air Force officials have awarded multimillion dollar contracts to BAE Systems and Boeing Co. as part of DARPA’s Intrachip/Interchip Enhanced Cooling Applications (ICECool Applications) program. The ICECool program seeks to develop advanced electronics cooling techniques for high-performance embedded computer (HPEC) and RF monolithic microwave integrated circuit (MMIC) … [Read more...]
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