Evtron, a St. Louis-based startup, officially launched Evtron CELL, a high-density server storage platform fitting 120 hard disk drives (HDDs) at the DEMO Fall 2012 conference. According to Evtron Founder Andrew Mayhall, the company has developed a technology that will solve one of the most complex problems facing companies today: storing the increasing amount of data available … [Read more...]
Detailed System Level Modeling of LEDs
Introduction Developments in solid state lighting (SSL) in recent years have led to an extensive increase in the driving current of light emitting diodes (LEDs). Although corresponding increases in light output and efficiency has also been noted, current lighting design applications require the implementation of multiple diodes to allow its utilization in universal lighting … [Read more...]
New QFN socket addresses high performance requirements for 0.5mm pitch devices
Ironwood Electronics recently introduced a new QFN socket addressing high performance requirements for 0.5mm pitch devices - SBT-QFN-4016. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 500,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss of < 1 dB at 15.7 GHz and capacitance 0.097pF. The current … [Read more...]
Changes in Surface Texture Double Heat Dissipation
Researchers at MIT have found that relatively simple, microscale roughening of a surface can dramatically enhance its transfer of heat by more than doubling the maximum heat dissipation. To test the process, the researchers made a series of postage-stamp-sized silicon wafers with varying degrees of surface roughness. They found that systematically increasing roughness led to a … [Read more...]
Designing Heat Sinks When a Target Pressure Drop and Flow Rate is Known
Forced convention air cooled heat sinks and liquid cooled cold plates are quite pervasive in their use in electronics cooling applications. While there can be significant debate on whether to air or liquid cool a particular component, the approach a thermal engineer would adopt to design both components is essentially similar. Parallel plate fins are the most common geometry … [Read more...]
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