It has been almost 3 years since I started this blog and I hope you’ve found it as interesting as I have cathartic. Although I’m not as yet bereft of topic ideas, I thought this would be a good time to solicit a guest blog from industry. It was either that or a Simponsesque montage of previous posts. I covered the highly successful provision of FloTHERM models of … [Read more...]
Simulation Software So Simple Even Teenagers Can Use It
The UK government has a policy for all year 10 or year 11 students to undertake a week’s work experience. Last week we welcomed a 15 year old student to the Mentor office where the FloTHERM and FloVENT software development is done. The student was tasked with simulating the air flow and temperature distribution in the office space using FloVENT. Using our own software to … [Read more...]
Bottlenecks and Interface Materials; Part 3 – Relieving Thermal Bottlenecks Reduce Temperatures
As with all good inventions, you quickly wonder how on earth you could have done without them before. Relieving thermal bottlenecks reduce temperatures; it’s so blindingly obvious. Now that we have the ability to visualise with FloTHERM exactly where the thermal bottlenecks are in a design, the job of the (overworked/underpaid) thermal design engineer just got that more … [Read more...]
Bottlenecks and Interface Materials; Part 2 – When TIMs Go Bad
‘Bits stuck onto other bits’, a succinct definition of an electronic product, if not a product that contains electronics. Soldering is the method of choice for getting the components to attach to the pcb, the layered board that contains the metallic traces connecting component pins to other component pins. Rivets, welds, screws or bolts for the chassis, some form of … [Read more...]
Bridging the Simulation Supply Chain; NXP Semiconductors, a Case in Point
By far and away the most common enquiry by someone using FloTHERM, especially at the start of their adoption, is “How do I model my components?”. This is hardly surprising as the mainstay of electronics thermal management is the control of operating component temperatures (junction and/or case). A virtual prototyping design by simulation approach requires models of components … [Read more...]
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