Lumped block package representation makes the best use of limited available data to simulate for an ‘indication’ of case temperature. Some indication is better than none but I wouldn’t bet on it, really, I wouldn’t. Accurate case and junction temperature prediction can only be realised with either a fully 3D detailed representation or an abstracted CTM … [Read more...]
What’s black and stuck on a PCB?
Hmmm… If you’re guessing it’s a chip package, you’re right – got it in one. Well done! OK, so what type of package is it? If you’re thinking it’s a silly question as you don’t know anything about the package, other than I’ve told you its black - that was a hint that it’s an encapsulated plastic part by the way - you’d be right. You’d need me to tell you if it had leads, and if … [Read more...]
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