The testing and troubleshooting of high power and high frequency systems such as distributed antenna systems (DAS), base stations, and various radar applications require buffering to prevent a power overload to the testing equipment and sensitive subsystem internal circuitry. With powers as high as 60 dBm (1000 Watts), radio frequency (RF) terminations and attenuators are … [Read more...]
What a Thermoelectric Cooler is REALLY Good For…
Fairy tales… perpetual motion machines… Not all fairy tales are perpetual motion machines, but all perpetual motion machines are certainly fairy tales. Before I get into the specifics of thermoelectric coolers, however, it seems appropriate to set the stage for this particular category of fairy tales. There are two classical types of perpetual motion “machines,” called (not … [Read more...]
Avionics Thermal Management of Airborne Electronic Equipment, 50 Years Later
BACKGROUND In a proposal submitted to the Air Force in November of 1968, Collins Radio Company described ways to improve the electronic industry’s understanding of thermal management and predictive techniques [1]. This article briefly describes that proposal and discusses what aspects of electronics cooling have changed over the past five decades and what things have … [Read more...]
Introducing Our New Technical Editor – In the End, Entropy Always Wins… But Not Yet!
Greetings to all Electronics Cooling’s loyal readership and visitors, I have recently had the privilege of joining the Electronics Cooling team alongside the incredible Editorial Board and ITEM Media. My goal as part of the team is to help the experts on the Editorial Board and ITEM Media production staff to continue driving Electronics Cooling to add the most value to its … [Read more...]
Application of Metallic TIMs for Harsh Environments and Non-flat Surfaces
Co-authored by: David L. Saums and Tim Jensen DS&A LLC and Indium Corporation INTRODUCTION Electronic systems, implemented in such diverse industries as aerospace, vehicle, geothermal exploration, and mobile devices with a range of more challenging application conditions, create new challenges for component and material reliability. Non-flat mounting conditions, … [Read more...]
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