Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]
Organically Grown 3D Printable Heatsinks – Part 4 A Fully Automated Methodology
The additive design methodology itself is quite straightforward. It is however highly repetitive. Perform a simulation, identify a maximum temperature location, extend the geometry at that point, if thermal efficiency decreases then repeat. To appreciate and to evolve the approach I began by manually performing a number of the initial steps myself. Solve in FloTHERM, sort … [Read more...]
Organically Grown 3D Printable Heatsinks – Part 3 Smoothing the Edges
The shape of the small piece of geometry that is added so as to successively ‘relieve’ the design determines the overall ‘jaggedness’ of the final geometry. A square section rod can only lead to a stair-stepped representation of angled portions of the shape, at worse resulting in a 41% increase (2/root2) in surface area in those regions. Increase in surface area, thus … [Read more...]
Organically Grown 3D Printable Heatsinks – Part 2 Trunks and Branches
Adrian Bejan’s Constructal Law states: “For a finite-size system to persist in time (to live), it must evolve in such a way that it provides easier access to the imposed currents that flow through it.” This can be seen at play in both animate and inanimate systems, from trees to lighting, from river systems to lungs. Such persistent systems tend to carry something … [Read more...]
Circuit Credit Card Assembly Heat Sinks Embedded with Oscillating Heat Pipes
Joe Boswell, Chris Smoot, Elliot Short, Nate Francis Introduction In this study, lightweight two-phase heat sinks embedded with the Oscillating Heat Pipe (OHP) technology are developed for the thermal management of military circuit card assemblies (CCA). OHP-embedded heat sinks efficiently transport heat generated by CCA centrally located components to the assembly’s … [Read more...]
- « Previous Page
- 1
- …
- 20
- 21
- 22
- 23
- 24
- …
- 57
- Next Page »