The global market for Electronic Thermal Management is forecast to reach $8.6 billion by 2015, according to market research company Electronics.ca Publications. Factors driving growth include developments in technology and marked increase in the production of miniaturized microprocessors. Further, increased use of mobile devices is likely to impact market growth. In the … [Read more...]
New Snap-in Aluminum Electrolytic Capacitors
TDK-EPC, a group company of TDK Corporation, has developed snap-in aluminum electrolytic capacitors from EPCOS that enable optimal contact to heat sinks. This permits link circuit capacitors to be efficiently cooled, significantly increasing their ripple current capability and operating life. As a result, the new capacitors are especially suited for applications in frequency … [Read more...]
Heat Pipe-Assisted Heat Sinks for Power Electronics Cooling
Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated turn-off thyristors (SGCTs), and silicon controlled rectifiers (SCRs). Power electronic … [Read more...]
ElectronicsCooling Winter 2010 Issue
Don’t miss out on the Winter 2010 issue of ElectronicsCooling, which includes a sneak peek at SEMI-THERM 27, feature articles on open bath immersion cooling, and energy consumption of data centers, as well as technical briefs. If you would like to receive your free copy of ElectronicsCooling click here to subscribe. Read the Winter 2010 issue here. … [Read more...]
Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 1
Bruce Guenin, PhD Associate Technical Editor The need to accommodate increasing chip power has led to improved package and heat sink designs having much lower thermal resistance values than previously. This has led to challenges in accurately calculating the thermal performance of the package and heat sink as an integral unit on the basis of thermal resistance measurements … [Read more...]
- « Previous Page
- 1
- …
- 37
- 38
- 39
- 40
- 41
- …
- 57
- Next Page »