High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a 1U rack-mount form factor. The current dual-processor system concept is targeted at the front-end server market (e.g., web hosting and mail routing), … [Read more...]
Quick and easy fan/sink characterization
It is often necessary to generate in-house pressure-drop and base-to-ambient thermal resistance data for ducted fan/heat sink assemblies. For reliable applicability of the performance data, the configuration of the test article should closely match the intended application so that the test article coolant flow characteristics (turbulence level, 3-dimensionality, etc.) match … [Read more...]
There's something for everybody on talk radio
I was doing my Sunday morning (2 a.m.) radio call-in show about electronics cooling (Hot Air on the Air with Tony K), when I heard a familiar voice on the line. "Herbie in Hereford," I greeted the caller, "You're on the air with Hot Air." "First time caller, long time listener . . .," the caller said. "Wow. There must be an insomnia epidemic," I interrupted. Johnny, the … [Read more...]
Estimating Temperatures in a Water-to-Air Hybrid Cooling System
As most readers are no doubt aware, the trend towards ever increasing processor module power is making it more and more difficult to cool directly with air. Many thermal engineers are convinced that water cooling may be the answer. This does not necessarily mean that cooling water must be supplied by the customer. Instead, in some instances it may be possible to use a … [Read more...]
Flash Diffusivity Method: A Survey of Capabilities
The development, specification, and quality control of materials used in electronics packaging and thermal management often require the measurement of thermophysical properties.This data can be critical to a successful design, especially with the rapidly increasing cooling requirements that result from the packaging of higher performance devices. A variety of methods, involving … [Read more...]
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