Rao R. Tummala, a researcher and educator who has made seminal contributions to microelectronics packaging, has been honored by IEEE with the 2011 IEEE Field Award in Components, Packaging and Manufacturing Technologies. The award recognizes Tummala for pioneering inventions such as the industry’s first plasma display and the first (and next three generations of) multichip … [Read more...]
Thermoelectrics that use Electricity to Provide Cooling Power
Phononic Devices is building thermoelectric modules that use electricity to provide cooling power. Such modules essentially replace the flow of refrigerants through vapor compression cooling systems with the flow of electrons through a chip. Solid-state cooling would eliminate a system's moving parts and its refrigerants, which are usually potent greenhouse gases. And with the … [Read more...]
Deploying a Data Center at a Quarter of the Cost
Offering a high-performance, energy-efficient alternative to traditional data centers at a fraction of the cost, the HP POD 240a, nicknamed the HP EcoPOD, delivers modular data center efficiency. HP EcoPOD is designed to deliver savings and accelerate the move to modular data centers. Unlike traditional brick and mortar data centers, the HP POD 240a packs 10 times the IT … [Read more...]
Learn How to Solve Data Center, Computer Room Cooling Problems
In a typical data center more than 40% of total power consumption is spent on cooling and thermal management. This makes thermal and energy efficiency one of the most important and challenging tasks for data center and computer room managers. The program for the 2011 Advancements in Thermal Management, which will be held Sept. 20-21 in Nashville, Tenn., will feature educational … [Read more...]
Technical Training Conference for FloEFD, FloTHERM and FloVENT Users
Sept. 12-13, Hampton Court, UK The agenda is tailored especially for users such as yourself and has been designed to enable you to learn valuable information about our products and provide you with insightful technical training. Day 1 - keynote address, executive roundtable, product direction and separate tracks for Thermal Simulation, HVAC and General … [Read more...]
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