In this paper from Texas Instruments, the authors present a novel power package design that enables heat conduction to the top surface of the microelectronic package through the use of a high thermal conductivity path which reduces by more than a factor of ten the junction-to-top thermal resistance compared to standard solutions. The paper discusses the design, … [Read more...]
Testing Thermal Interface Material (TIM) Analysis
2-3 p.m., March 10 This webinar will provide an introduction to the most commonly used Thermal Interface Material (TIM) types and their corresponding testing techniques. Basic TIM properties such as bulk or effective thermal conductivity, interfacial thermal resistance and bond line thickness will be explained. At the beginning, an overview of the existing industrial and … [Read more...]
DesignCon 2011
Feb. 1-2, Santa Clara Convention Center, Santa Clara, Calif. Tracks include Chip-Level System Design and Verification, High-Speed Signal Processing, Equalization and Coding, Power Integrity and Power Distribution Networks, Electromagnetic Compatibility and Interference, Test and Measurement Methodology, RF and Microwave Signal Integrity, Analog and Mixed-Signal Design and … [Read more...]
NewSpring Capital Makes Growth Investment in Raritan Inc.
NewSpring Capital, a provider of private equity capital in the Mid-Atlantic region, has made an investment to support Raritan’s power management business that helps companies improve energy efficiency and operations in their data centers. Raritan plans to use the investment proceeds to facilitate its growth in the data center power management market through the development of … [Read more...]
Researcher Wins Award for Electronics Cooling Technologies
The National Science Foundation has awarded the 2011 Alexander Schwarzkopf Prize for Technological Innovation to a Purdue University professor for his research to develop advanced cooling technologies for electronics and cars. The prize specifically recognizes Suresh V. Garimella’s work to develop “two-phase microchannel heat sinks” to cool high-power electronics in electric … [Read more...]
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