CEO of LiquidCooling Solutions, Inc., Herb Zien, is serving on a panel until Thursday, Sept. 24, at the North America’s Emerging Green Conference in Portland, Oregon. On Wednesday Sept. 23, from 1:30 – 3:00 p.m., Zien will give a presentation that challenges the legitimacy of Free Cooling. Zien will explain inefficiencies and environmental waste associated with free cooling via … [Read more...]
Solution to Heat Transfer in Phase Change Materials Unveiled
Dr. Patrick Shamberger, assistant professor at Texas A&M University, has found an “analytical solution to heat transfer in PCMs (Phase Change Materials) used in thermal energy storage and has identified the relative role of thermo-physical properties of different materials,” according to Phys.org. Shamberger is one of the lead researchers studying high-energy storage … [Read more...]
Thermal Invisibility Cloak Improves Heat Distribution in Electronics
A team of researchers from the Nanyang Technological University (NTU) in Singapore has developed a thermal invisibility cloak that would improve heat distribution in electronic devices by redirecting incoming heat. The cloaks are capable of guiding heat around a hidden object, thus resulting in complete thermal invisibility. “Based on carefully engineered metamaterials – … [Read more...]
Electronics Cooling September 2015 Issue Now Online
Don’t miss out on the September 2015 issue of Electronics Cooling, which includes feature articles on Heatsink Geometry Topology; On-site Cogeneration for Reducing Data Center Primary Energy Use; a Thermal Live Advance Program; and more. If you would like to receive your free copy of Electronics Cooling click here to subscribe. Read the September 2015 issue … [Read more...]
University Produces Smart Compliers to Assist Research During ‘Dark Silicon’ Era
Researchers from Lancaster University believe a ‘dark silicon’ era is rapidly approaching. This era suggests more than 80 percent of computer processors’ transistors will be turned off and ‘remain dark’ in order to prevent the chips from overheating. “Hardware design is rapidly evolving to prevent this need to 'power down' transistors and coming up with innovative solutions. … [Read more...]
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