The U.S. Patent and Trademark Office has awarded patent No. 8,546,935, “Semiconductor Packages,” to Micron Technology, Inc. of Boise, Idaho. According to background information provider by the inventors, the patent covers “semiconductor packages having grooves within a semiconductor die backside, and includes semiconductor packages utilizing carbon nanostructures (such as, for … [Read more...]
New Patent Covers System for Clamping Heat Sink
The U.S. Patent and Trademark Office has assigned patent No. 8,546,192, “System for Clamping Heat Sink,” to Harman International Industries, Inc. in Stamford, Conn. According to the background information provided by the inventor, the patent covers “a system for clamping a heat sink that prevents excessive clamping force. The system may include a heat sink, a semiconductor … [Read more...]
'On-Demand' Nano-sized Heat Sinks Lower IC Temperatures
Scientists at RMIT University in Australia have released research that demonstrates a new method of heat dissipation on the nanoscale level. In a paper published in the online journal Advanced Energy Materials, Kourosh Kalantar-zadeh, a professor at the School of Electrical and Computer Engineering, and his colleagues demonstrate the “on-demand” creation of tiny nanofin heat … [Read more...]
View our Webinar and Q&A on ‘Advanced Carbon-Based Thermal Management Materials and Applications’
On September 25, 2013, Carl Zweben presented a live webinar on Advanced Carbon-Based Thermal Management Materials and Applications. Overview: In this webinar, we consider advanced carbonaceous (carbon-based) materials, which are now well established, and are being used in a large and increasing number of commercial and aerospace/defense applications. Examples include various … [Read more...]
Webinar Question & Answers
Editor’s note: These questions were asked in response to Electronics Cooling’s recent webinar by Carl Zwebin. To view the webinar, click here. Question: Al/SiC is an attractive material. Is there a need for other new composites? Answer: There is no one universal material. There is a need for low-CTE materials with thermal conductivities higher than those of … [Read more...]
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