Northwestern University researchers are investigating the possibility of vertical heat transport for better cooling devices. A new paper published in Physical Review Letters by researchers at Northwestern University in Illinois explores the idea of using materials in which heat flows perpendicular to an electric current to develop better devices for cooling … [Read more...]
Effectively Leveraging CAD Data in Electronics Thermal Simulation
June 26, 2013 Online "CFD modules embedded within MCAD software utilize native geometry but fail to deliver on solver speed, stability and built-in intelligence. Application specific CFD tools utilize parametric modeling objects allowing users to quickly create typical electronic components (PCBs, heat sinks, fans etc.). However, these advances are lost when importing … [Read more...]
Beware… When Cooling Practices Fail! Webinar Part II
June 25, 2013 Online In this webinar, "Ramzi Namek and Eric Fournier of Total Site Solutions, will present an actual customer situation they were called in to assess: a partially-contained hot aisle was seemingly causing hot air to appear at the front of the racks—a problem that had not been there before! The Total Site Solutions team used the 6SigmaRoom software to study … [Read more...]
Micro-Vacuum Technology May Cool Future Smartphone Processors
Researchers from the University of Michigan, Massachusetts Institute of Technology (MIT) and Honeywell International, Inc. have developed microscale vacuum pumps that could lead to tiny, more efficient cooling systems for faster processors in smartphones. Developed as part of DARPA’s Chip-Scale Vacuum Micro Pumps (CSVMP) program, the new microscale vacuum pumps are intended … [Read more...]
Electronics Cooling Announces New Editor
Electronics Cooling is proud to announce the addition of Peter Rodgers to the technical board. Rodgers is currently an associate professor of mechanical engineering at The Petroleum Institute, Abu Dhabi, UAE. He previously worked at the University of Maryland; Nokia (Finland); Electronics Thermal Management, Ltd. (Ireland), and the University of Limerick (Ireland). He is a … [Read more...]
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