Electronics thermal management provider Cambridge Nanotherm has announced plans to build its first prototype manufacturing plant in Haverhill, UK following the award of £250,000 in matched funding from the UK Innovation Agency - Technology Strategy Board (TSB). The company plans to use the new facility to further develop its new nanoceramic-aluminum substrate technology, and to … [Read more...]
DuPont Increases Thermal Substrate Production to Accommodate Demand
DuPont Circuit & Packaging Materials, part of DuPont Electronics & Communications, announced earlier this week that it has increased production at its Hsinchu, Taiwan facility by more than seven times the previous amount to better accommodate demand for its CooLam thermal substrate products. DuPont CooLam thermal substrates are designed to help dissipate heat in LED … [Read more...]
Environmental Regulations and Cloud Computing to Affect Asia-Pacific Data Center Cooling Market
New market analysis from business consulting firm Frost & Sullivan has suggested the data center cooling solutions market in the Asia-Pacific will double by 2018, in part due to the increasing emphasis on data center efficiency and the growing demand for cloud-based services. The report, “Asia-Pacific Data Center Cooling Solutions Market,” estimates the market-generated … [Read more...]
World Congress on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics
June 16-20, 2013 Lisbon, Portugal The 8th World Congress on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics offers attendees a forum for the exposure and exchange of ideas, methods and results related to heat transfer, fluid mechanics and thermodynamics. Presentations will cover fundamental topics, including measurement techniques and image processing, heat and … [Read more...]
New Method Uses Paper and Inkjet Printer to Create More Heat-Tolerant Carbon Electronics
Researchers at the Max Planck Institute of Colloids and Interfaces in Potsdam-Golm, Germany have developed a simpler and more cost-efficient means of creating microchips for electronics applications using paper and a conventional inkjet printer. The use of flexible, cost-efficient microchips as a replacement for silicon chips, which are more expensive and difficult to make, is … [Read more...]
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