High performance analog IC and sensor provider ams AG has introduced the AS3721, a power management IC (PMIC) with an innovative remote-feedback circuit designed to help reduce the thermal stress of applications processors in smartphones and tablets. When paired with ams’ new AS3729 point-of-load regulators, AS3721 provides a complete power management system that offers a fast … [Read more...]
Material Solutions for High-Frequency, High-Thermal-Reliability and Multilayer Circuits
Rogers Corporation, a manufacturer of specialty materials and components that enable high performance and reliability of consumer electronics, power electronics and telecommunications infrastructure, will be featuring its new high-Dk RO4360G2 laminate and 2929 bondply materials at the PCB West 2013 conference and exhibition Sept. 25, 2013 in Santa Clara, Calif. According to … [Read more...]
Researchers Developing New Thermoelectric Materials
New technology from researchers at the University of Houston has the potential to increase vehicle mileage by five percent and power plant and industrial processing performance by as much as 10 percent. The breakthrough combines tin telluride and chemical element indium in a material that can capture waste heat and convert it into electricity. According to Zhifeng Ren, M.D. … [Read more...]
New Low Resistance TIM Delivers 6.0 W/m°K Thermal Conductivity
Thermal interface material provider Fujipoly has released Sarcon GR45A-00, a very low modulus thermal interface material with a low thermal resistance. Featuring a thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 1.33°C cm2/W, the new formulation completely fills air gaps between components, board … [Read more...]
Micro-Vacuum Technology May Cool Future Smartphone Processors
Researchers from the University of Michigan, Massachusetts Institute of Technology (MIT) and Honeywell International, Inc. have developed microscale vacuum pumps that could lead to tiny, more efficient cooling systems for faster processors in smartphones. Developed as part of DARPA’s Chip-Scale Vacuum Micro Pumps (CSVMP) program, the new microscale vacuum pumps are intended … [Read more...]
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