Product: EP21TPHT Release Date: 01/14/2020 Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical epoxy polysulfide systems. This room temperature curable adhesive also features convenient … [Read more...]
Forced-Air Cooling: Should You Push or Pull?
As much as we’d prefer to be able to use just unforced, natural convection cooling, many designs and installations simply cannot be cooled adequately by the low level and uncertainty of airflow that this low-cost, reliable approach offers. Instead, it’s very common to use one or more fans to force the air at a known volume and velocity through the enclosure or chassis … [Read more...]
New Cooling Plate Said to Dramatically Increase the Lifetime of High Temperature Electronics
Korea Institute of Machinery & Materials is first to develop a TGP that operates in any direction, improving cooling efficiency by modifying the surface of a porous structure. During the past decade, developments in semiconductor industries have allowed electronics such as sensors and actuators to be miniaturized so as to perform effectively in a limited space. As a … [Read more...]
TC350 Plus Laminates for Higher Microwave & Industrial Heating Applications
Rogers Corp. has introduced TC350 Plus laminates. TC350 Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and … [Read more...]
Managing Cooling Fan Noise In Product Design
ABSTRACT Cooling fan noise is a system property determined as much by thermal and mechanical design and fan selection as by a fan’s acoustical design. While even the quietest fan can be used in a noisy manner, a significant fraction of unpleasant surprises can be avoided. NOMENCLATURE C Numerical constant D … [Read more...]
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