Image Caption: A capacitor failure on a GPU board was caused from oil absorption through the capacitor’s rubber seats while emerged in white oil. As higher clock frequencies and smaller transistor dimensions continue to increase the power density of high-performance computing technologies, such as CPUs, GPUs, FPGAs, Laser Diodes, and Optical electronics, advances in thermal … [Read more...]
Join the Electronics Cooling Community of Authors and Bloggers!
Electronics Cooling invites you to share your expertise, knowledge, and perspective on critical aspects, foundational education, and trends with electronics thermal management technology. Electronics Cooling stands strong as one of the foremost resources for thermal management engineers and professionals, and much of this success is the result of a dedicated community of … [Read more...]
Rising Demand for Thermal Management in Consumer Electronics Prime Factor for Exponential Growth of Market
According to the new market research report "Thermal Management Market by Material Type (Adhesive, Non-Adhesive), Devices (Conduction, Convection, Advanced, Hybrid), Service (Installation & Calibration, Optimization & Post Sales), End-Use Application - Global Forecast to 2022", The thermal management market is expected to be worth USD 14.24 Billion by 2022, growing at a … [Read more...]
New Thermoelectric Controllers for Precise Temperature Control
European Thermodynamics are pleased to announce the launch of the new JUNIOR and CyCLO pulse width modulator (PWM) thermoelectric controller electronic PCBs. Developed to work with the Adaptive® thermoelectric assemblies and thermoelectric cooler (TEC) modules, JUNIOR and CyCLO are thermoelectric controllers that enable a precise method of temperature control for sensitive … [Read more...]
Application of Metallic TIMs for Harsh Environments and Non-flat Surfaces
Co-authored by: David L. Saums and Tim Jensen DS&A LLC and Indium Corporation INTRODUCTION Electronic systems, implemented in such diverse industries as aerospace, vehicle, geothermal exploration, and mobile devices with a range of more challenging application conditions, create new challenges for component and material reliability. Non-flat mounting conditions, … [Read more...]
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