Electronic component distributor Digi-Key has announced the availability of 3M’s 5590H series thermally-conductive acrylic interface pads for effective heat transfer and vibration dampining in demanding thermal applications. According to the company, the new 5590H series is ideal for cooling high intensity LEDs and bonding heat sinks, heat spreaders and other cooling devices to … [Read more...]
Cooling System for Small- and Medium-Sized IT Installations
Rittal Corporation, a manufacturer of industrial and information technology enclosures, racks and accessories, has released the Rittal Liquid Cooling Package Direct (LCP DX), a cooling system for small- and medium-sized IT installations where “climate control with air/water heat exchangers or cold water would be too costly.” Available in two versions suitable for rack-based or … [Read more...]
Liquid Cooling Option for Small and Medium Size IT Installations
Rittal Corporation, a manufacturer of industrial enclosures, server racks, power distribution systems and data center cooling products, has released the Liquid Cooling Package Direct Expansion (LCP DX) cooling option. According to the company, the LCP DX is flexible, easily installable and ideal for small and medium-sized installations where climate control with air/water heat … [Read more...]
Single Electron Diode May Control Heat Flow in Tiny Future Electronics
As the scale of electronic devices and their components continues to shrink, researchers at Aalto University in Finland are re-examining options for fine-tuning control of the heat generated by electronic components. Doctoral student Tomi Ruokola, in cooperation with researcher Teemu Ojanen of O.V. Lounasmaa Laboratory, has developed a single-electron diode that allows heat to … [Read more...]
Calculation Corner: Transient Thermal Modeling of a High-Power IC Package, Part 1
Part II can be found here. There is an increasing need for calculating integrated circuit temperatures during conditions of changing chip power. Varying computer workloads and the implementation of power-saving strategies are leading to greater variability in chip power levels than in the past. As reliability requirements get more stringent there are growing concerns about the … [Read more...]
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