Luso Electronics, a distributor of thermal management products, has announced the addition of Zaward Corporation’s patented “Golf Fan” products for thermal management in computing and industrial applications. According to Luso Electronics, the design for the new fans is based on “the dimpled surface of a golf ball” and “shows improved airflow and low noise at the same rotating … [Read more...]
New Liquid Cooling System Cools Submerged Electronics without Frying Them
Dr. John Summers demonstrates the Icetope liquid cooling system by submerging an iPhone in the 3M Novec solution. (Video: University of Leeds) Researchers at the University of Leeds in the United Kingdom have developed a cooling method that they claim reduces energy consumption for cooling by 80 to 97 percent by immersing server components in an electrically non-conductive … [Read more...]
Microsoft to Expand Hybrid Indoor-Outdoor “Roofless” Data Center
Microsoft has announced that the company’s newest data center campus will be expanded to include two more data center facilities. Located in Boydton, Va., the facility houses server racks both indoors and outdoors within larger enclosures as part of a hybrid design engineered to reduce operating costs and increase energy efficiency. The new expansion will bring the data … [Read more...]
Laird Technologies Acquires Thermoelectric Technology Developer Nextreme Thermal Solutions
Laird Technologies, a developer of components and solutions for electromagnetic interference protection and thermal protection of electronics, has announced the acquisition of U.S.-based manufacturer of thin-film thermoelectric technologies Nextreme Thermal Solutions. Though Nextreme and Laird currently have a strategic design and distribution partnership, the acquisition will … [Read more...]
New Magnetic Cooling Technology Decreases Environmental Impact of Cooling, Avoids Side Effects of Magnetic Fields on Electronics
Researchers from the University of Cambridge, U.K. and CIC nanoGUNE in Spain have developed a new cooling technology for the thermal management of computer chips and other miniaturized devices that utilizes materials that change their temperature when exposed to magnetic fields. Materials measuring only 20 nm tick and comprised of comprised of lanthanum, calcium, manganese and … [Read more...]
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