Lockheed Martin and the Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) want to cool high-powered microchips with microscopic drops of water. “A core team of Lockheed Martin engineers is working on a solution to meet the goal of DARPA’s Inter/Intra Chip Enhanced Cooling (ICECool) program: to enhance the performance of RF MMIC power … [Read more...]
New Smartphone to Use Heat Pipe Cooling
Samsung has declared that the new Galaxy S7 will use heat pipes for its cooling system. Smartphones typically lack ventilation holes and fans, so smartphone companies are moving to adopt heat pipes “because the technology should allow for more sustained boost clocking ad steadier overall performance,” according to ExtremeTech.com. “The other advantage of a heat pipe is that … [Read more...]
Scientists Grow Efficient Light-Emitting Organic Semiconductor Crystals
Recently, scientists from the faculty of physics of the Moscow State University have grown organic semiconductor crystals with extremely high light-emitting efficiency that can reduce the cost of creating light, flexible, and transparent light-emitting electronic devices, according to Phys.org. They challenged the growing of organic semiconductor crystals from a vapor phase … [Read more...]
Computing Hardware Overclocks to 7GHz Using Liquid Nitrogen
A man from Hong Kong broke the speed record for his Intel Skylake by overclocking to 7.025 GHz clock speed with liquid nitrogen cooling, as reported by DigitalTrends.com. To achieve this 75 percent boost, “the overclocker had to bootstrap a nitrogen cooling solution for their CPU, using its extremely low temperature (-321 degrees Fahrenheit to be exact) to draw heat away from … [Read more...]
Nominations Open for IEEE ITherm Achievement Award
The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research contributions, of service to the electronics thermal/thermo-mechanical management community, and of … [Read more...]
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