Master Bond’s EP93AOFR is a two-part thermally conductive epoxy adhesive that offers superior heat dissipation for a wide range of electronic applications. It can be used in encapsulation and potting applications, as well as in bonding, sealing, and coating. According to Rohit Ramnath, Senior Product Engineer, "This flame retardant non-halogenated system is not only … [Read more...]
Thermoelectric Assemblies Optimize Thermal Performance in any Outdoor Environment
Laird Thermal Systems has introduced a series of thermoelectric assemblies (TEAs) designed for use in outdoor environments. The Outdoor Cooler Series are compact (cooling objects via convection) air-to-air TEAs said to provide a lower total cost of ownership by maintaining the appropriate temperature range using minimal energy due to its high coefficient of performance … [Read more...]
Heat Exchangers Cool Electrical Enclosures, Keep Dust Out
Industrial air conditioner units are typically the solution for cooling sealed enclosures. What designers sometimes fail to consider, however, is that a cooler ambient environment could be used to help cool warmer electrical enclosure, particularly when there is a temperature difference between the internal target temperature and the surrounding temperature of ∆T≥10°C. … [Read more...]
CoolIT Systems Partners with Intel to Develop Direct Liquid Cooling solutions for Xeon Scalable Processors
CoolIT Systems has partnered with Intel to develop Direct Liquid Cooling solutions for Intel Xeon Scalable CPUs, including the recently announced Advanced Performance processors (codename Cascade Lake) coming in the first half of 2019. Cascade Lake represents a new class of Intel Xeon Scalable processors designed for demanding high-performance computing (HPC), artificial … [Read more...]
One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications
Master Bond EP17HTND-CCM is a new single component epoxy that is not premixed and frozen. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste consistency ideal for glob top, chip coating and bonding applications. EP17HTND-CCM meets NASA low outgassing specifications and is … [Read more...]
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