Recently SANYO DENKI has released their new high static pressure fan, the San Ace 60 9HV type. The San Ace 60 9HV type is 60 x 60 x 38 and has a PWN control function, which controls the “rotational speed of the fan from the device side,” according to the company. It is suitable for 1.5 to 2U sized devices and has a maintained maximum airflow performance equivalent to the … [Read more...]
New Hybrid Adhesives Use UV Cure and Heat Cure Combination
Epoxy Technology Inc. has released a new line of UV Hybrid adhesives. The company says these adhesives allow “engineers to reach new levels of production/process improvement” and afford “greater design flexibility.” They use “a primary UV cure for tacking, followed by a secondary heat cure for completion,” according to Epoxy, “This unique combination affords engineering … [Read more...]
Extreme-Temperature Probing Solutions Offered
Keysight Technologies recently introduced the N7007A extreme-temperature 400-MHz passive probe and the N7013A extreme-temperature extension kit for medium- and high-voltage differential active probes. According to the company, the extreme-temperature probing solutions offer bandwidths up to 400 MHz, and can withstand temperatures ranging from -40 degrees to +85 degrees … [Read more...]
New Soft TIM with Low Thermal Resistance
Fujipoly recently introduced the Sarcon® GR80A, which is a soft thermal interface material that also has a low thermal resistance. According to the company, the thermal interface material is available in sheets from 0.3mm to 3.0mm thick and can be die-cut to fit almost any application shape. “When placed between a heat source such as a semiconductor and a nearby heat sink, … [Read more...]
High Temperature Resistant, Thermal Conductive System Meets ASTM E595 Specifications
Master Bond’s MasterSil 972TC-LO, a high temperature resistant, thermally conductive system, now meets the requirements for low outgassing per ASTM E595 specifications. “MasterSil 972TC-LO is an insulator that has a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)]. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics, … [Read more...]
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