Fujipoly recently introduced the Series 5002 Silver Zebra connector. The connector is a low-cost, long-life option for LCD to printed circuit board connections, and can be used as a board to board connector where space is limited. It has a “carrying capacity up to 300 mA per square .040”and exhibits a contact resistance of less than 500 mΩ,” Fujipoly said. The Series 5002 … [Read more...]
Industry Leading Airflow and Static Pressure Fan Introduced
Sanyo Denki has announced its new high airflow fan, the San Ace 140 9GV type, which offers the industry’s highest airflow and static pressure. It has 6.8 times the static pressure and 2 times the airflow than other DC fans on the market. “The San Ace 140 9GV type has the PWM control function, designed for controlling the rotational speed of the fan from the device side,” … [Read more...]
New Internal Mount Coolers Ideal for Enclosure Cooling
TECA introduces a new line of coolers, which are internally mounted air conditioners ideal for enclosure cooling. Because these thermoelectric coolers are highly reliable and almost maintenance free, they are ideal for areas that are hard to access. They also don’t have refrigerants, compressors or any moving parts except fans. The coolers offer horizontal or vertical … [Read more...]
New Thermal Management Material for Semiconductors
Honeywell Electronic Materials has announced the availability of a new thermal management material for semiconductors – the Honeywell PTM6000 Phase Change Material (PCM). The PTM6000 was designed to meet both high performance needs and long lasting reliability. “Honeywell’s proven PTM and PCM series of thermal management materials are based on sophisticated phase-change … [Read more...]
One-component Epoxy Cures at 200-220°F
Master Bond introduces a new one-component epoxy, the Master Bond EP17HT-100, which is resistant to high temperatures and cures in 60-90 minutes at 200-220 degrees Fahrenheit. The EP17HT-100 is ideal for bonding, encapsulation, potting and sealing applications. “Cures can be accelerated at higher temperatures. This low heat curing schedule is useful in bonding applications … [Read more...]
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