In a recent blog post, Robert Smith discusses heat sink optimization through the use of pin fins. “Local heat transfer coefficients are highest when the air first begins to form a boundary layer. The benefit to lots of pins is that you force the boundary layers to break away often and re-create on the next pin,” Smith said. The heat sink forms a 3D mesh of pins that cross … [Read more...]
Presentation on 4H SiC Epitaxial Wafer Quality and Layer Growth
Dow Corning will present at the 16th International Conference on Silicon Carbide and Related Materials (ICSCRM) Oct. 4 through 9. ICSCRM is a technical conference that provides information on electronics device technology based on silicon carbide (SiC) and related materials. It brings qualified experts together to discuss crystal growth and characterization, control of … [Read more...]
Interactive 3D Thermal Heatsink Modeling Simulation Software
Yesterday, during the 2015 IEEE ECCE conference and exposition in Montréal, Canada, Mersen presented the R-Tools GEN III. Mersen will show the redesigned interactive 3D Thermal Heatsink Modeling simulation software today, Sept. 22, as well. “R-Tools Gen III is a free on-line simulation software that allows users to model the optimum air cooled heatsink solution tailored to … [Read more...]
Two Phase Cooling System for Data Centers
Ebullient introduces a two phase cooling system for data centers - the Ebullient Cooling System (ECS). It can cool up to 12 heat sources in series in a continuous loop while maintaining a device temperature of +/-2 degrees Celsius. It also offers flexible tubing which allows the system to adapt to hardware without modification. The cooling system “is composed of Ebullient’s ES … [Read more...]
Non-drip Epoxy Paste Cures Optically Clear
Master Bond Inc. introduces the Master Bond EP21NDCL - a new two component non-drip epoxy paste that cures optically clear in thin sections. It is ideal for bonding, coating and sealing applications in aerospace, electrical, opto-electronic and specialty OEM industries. The Master Bond EP21NDCL bonds well to plastics, rubbers, glass, metals, ceramics and other materials and it … [Read more...]
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