EXAIR has introduced new small NEMA 12 cabinet cooling systems to keep electrical enclosures cool while resisting heat and dirty environments that could adversely affect the internal components. Featuring a cooling capacity of up to 275 Btu/hr or 550 Btu/Hr, the new EXAIR cabinet coolers circulate 20°F (-7°C) air throughout the enclosure to prevent high temperature … [Read more...]
Thermal Material Provides Both Compressibility and Conformability with Phase-Change Ability
AI Technology, Inc. has released COOL-PAD™ CPR7154, a thermal interface material that dispenses like a thermal pad but exhibits characteristics like that of a grease or gel when device temperatures increase to above 45°C. Ideal for use in LEDs, gaming consoles, laptops and desktop computers, COOL-PAD™ CPR7154 is optimized to accommodate large areas with different heights and … [Read more...]
New Thermal Adhesive Boasts Twice the Conductivity at Half the Cost
3M’s Electronics Markets Materials Division (EMMD) has released 3M 8904, a thermally conductive adhesive tape for thermal management and part bonding in electronic devices, as well as general heat dissipation. Containing thermally conductive particles as well as flame resistant fillers, 3M 8904 offers twice the thermal conductivity at half the material cost. The new adhesive … [Read more...]
High Thermal Conductivity Thin Film
Fujipoly America has announced Sarcon 30-YR-a Thin Film, a new high performance thermal interface material. Measuring just 0.3mm thick, the Sarcon 30-YR-a thin film exhibits a thermal conductivity of 2.2 W/m°K with a thermal resistance of .28°Cin2/W. When placed between a heat source such as a high-performance semiconductor and a nearby heatsink, Sarcon 30-YR-a effectively … [Read more...]
Liquid Cold Plate Cools Power Electronics
Thermal management company GCoreLab has introduced a new generation of cold plates for the cooling of power electronics. The new XtremeChill liquid cold plate utilizes GCoreLab’s patented oblique fin technology, which offers superior thermal cooling and heating performance with no pressure drop. The technology, first developed by Professor PS Lee at the National University of … [Read more...]
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