Oven Industries, suppliers of custom temperature controllers and sensors, has released a new high powered temperature controller that can be used on a heat sink, allowing for a “seamless transition between heating and cooling devices.” The new controller has many benefits and is user friendly, with a “bi-directional and unidirectional H-bridge” as well as software to alter the … [Read more...]
New Patent-Pending Heat Sink Mounting System
Penn Engineering has released the new patent-pending PEM heat sink mounting system for secure attachment of heat sinks to circuit boards. According to the company, the new heat sink mounting system consists of “Type HSCB captivating screw and Type HSL spring mated to Type HSR™ broaching receptacle nut or standoff. . . . Screws can be installed into aluminum or steel sheets as … [Read more...]
Embedded Heat Pipe Technology for Heat Removal in Military Applications
Researchers at Advanced Cooling Technologies Inc. have developed a new cooling technique for high-power VPX embedded computing cards that utilizes embedded heat pipes to increase heat removal for computer boards. The new Dual-Sided Condenser technology is ideal for military embedded computing applications, including radar signal processing, avionics electronics boxes and RF and … [Read more...]
Cooling Filters and Venting Products for Range of Telecommunication Applications
Fluoropolymer technology and manufacturing company W.L. Gore & Associates has announced that it will debut its latest venting products and cooling filters for use by the telecommunications industry at the CTIA 2013 Mobile Marketplace in Las Vegas, Nev. later this month. According to the company, ideal applications for the new products range from use in mobile phones and … [Read more...]
Dispensable Thermal Pads for Thermal Management in LED Lighting Applications
Dow Corning, a developer of silicone-based technology, has announced new dispensable thermal pads developed for more cost-effective thermal management in LED lighting applications. Dow Corning’s new product line of dispensable thermal pads features four grades “distinguished by varying levels of thermal conductivity with or without controlled bond line thicknesses.” Dow … [Read more...]
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