German power supplies manufacturer Be Quiet! Has released DC1, a new high performance thermal compound for critical cooling applications. According to the company, the new electrically non-conductive, metal oxide-silicone thermal compound features a “very high thermal conductivity of 7.5w/mK [that] provides exceptional heat transfer between chip and cooler” and is capable of … [Read more...]
New Customizable Heat Sinks for Use in High Power Environments and Resistors
Ohmite Manufacturing, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has announced two new heat sinks: the C series modular heat sink for use in high power environments and the CP series of cold plate four-pass heat sinks for use with the company’s 1,000 and 2,000 watt TAP series of resistors. The new heat sinks will … [Read more...]
Advanced Circuitry Option for Thermoelectric Cooling Unit Enables Maximum Cooling Output “Regardless of Available Power Supply or Integrity of Voltage Flow”
EIC Solutions, Inc., a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has announced the availability of an advanced circuitry engineering option for the company’s thermoelectric cooling units that enables “maximum cooling output regardless of available power supplies or the integrity of the voltage flow.” The new advanced circuitry … [Read more...]
40x40x56mm Counter-Rotating Fan for High-Density 1U Servers, Power Supplies and High-Density Electronic Enclosures
Thermal solutions provider JMC Products has released a new 40x40x56mm counter-rotating fan ideal for high-density 1U servers, power supplies and high-density electronic enclosures. According to the company, “counter-rotating technology has allowed engineers at JMC to design [the fan] with extremely powerful airflow and speed, while maintaining high efficiency and an … [Read more...]
New Type of Heat-Conducting Paste “Optimized” for Thermal Management of Power Semiconductors
Infineon Technologies AG and Henkel Electronic Materials have collaborated to release a new type of heat-conducting paste “optimized” for thermal management of power semiconductors. According to the two companies, the new compound allows a higher power density for the same ageing resistance. According to Dr. Martin Schulz of Infineon Technologies AG, “[LOCTITE TCP 7000] … [Read more...]
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