Cooling systems developer Vortec has announced the company’s newest enclosure cooler has received official UL certification this month. According to the company, the new enclosure cooler utilizes a “unique two-stage cooling process” to effectively cool large enclosures. The cooler is capable of removing heat “at up to 5,000 BTU/hour.” “The Dual HazLoc Vortex A/C has higher … [Read more...]
New Dual Drive Bay CPU Liquid Cooling System Released
Thermaltake, a manufacturer of power supply units, cases and cooling devices, has released the Big Water 760 Pro, a CPU liquid cooling system. The Big Water 760 Pro features a dual drive bay design and a redesigned aluminum fan radiator “that is optimized for maximum heat dissipation” with a 120mm fan “to deliver better performance and extra low noise while cooling is … [Read more...]
Thermal Management PCB for Use with LEDs
Thermal management company SinkPAD has announced the release of the SinkPAD Star PCB for use with the new Luxeon-T and Cree MK-R LEDs. The new thermal management PCB will be on display at the Strategies in Light Show in Santa Clara, Calif. in mid-February. According to the company, the SinkPAD Star PCB conducts heat out of the LED system by “creating a direct thermal path … [Read more...]
New CPU Coolers Win 2013 CES Innovation Awards
Computer cooling product developer Zalman has introduced the new CNPS FX100 Cube fanless CPU cooler and CI Water Cooler. Both coolers received Innovations design and engineering awards at the 2013 Consumer Electronics Show in Las Vegas, Nev. and will be launched in the second quarter of 2013. According to the company, the new FX100 Cube fanless cooler is compatible with a … [Read more...]
Board-Level Heat Sinks for Semiconductor Devices in D2Pak, SOT-32, TO-220, and TO-263 Packages
Electronic components distributor Digi-Key has released the Assmann WSW line of board-level heat sinks for use in industrial process control equipment, telecommunications equipment, consumer products and automotive applications. According to the company, the heat sinks provide “optimal heat transfer,” due to “uniform pressure.” The new board-level heat sinks are available in … [Read more...]
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