Air Innovations’ ability to address demanding specifications was recently showcased when a global supplier to the semiconductor and photomask-making industries outlined the need for an environmental control unit that could service any of its nanomachining mask repair tool systems on demand. Sophisticated and intricate masks are used in the manufacture of all integrated … [Read more...]
New Socket Addresses High Performance Requirements
Ironwood Electronics has introduced a new MicroSD socket, SBT-MicroSD-01, addressing high performance requirements for Speed Class Rating, which guarantees a minimum rate at which data can be written to the card. The contactor is a stamped spring pin with 19 gram actuation force per pin and cycle life of 500,000 insertions. Low force eliminates pin sticking issues from … [Read more...]
New Heatsink Supports More Package Sizes
Ohmite Manufacturing Company, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has introduced the Ohmite C Series heatsink which now supports most resistor package sizes from TO-126 to TO-264. Ideal for high power density and small size (1U or 2U) electronic packaging with forced convection cooling, the heat sink … [Read more...]
New Thermally Conductive Silicone Thermal Interface Material
NuSil Technology LLC presents EPM1-2493, a low-viscosity, low modulus silicone elastomer with a nominal thermal conductivity of 1 W/mk. Offering bond lines as thin as 5 microns, EPM1-2493 can be used to adhere materials with differing coefficients of thermal expansion (CTE) for significant stress reduction during thermal cycling. EPM1-2493 does not have the typical paste-like … [Read more...]
3200 BTU Thermoelectric Air Conditioner
EIC Solutions has introduced a 3,200 BTU thermoelectric air conditioner. The new air conditioner employs 50 percent more thermoelectric chips (TECs) with a minimal change in the overall dimensions of the unit. The footprint is identical to the 2,500 BTU model allowing for simple changeovers to achieve increased cooling capacity in existing applications or minimal design changes … [Read more...]
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