Purdue University researchers, led by Suresh V. Garimella, have developed a new design employing carbon Nanotubes and small copper spheres that wicks water passively towards hot electronics that could meet the challenges brought on by increasing frequency speeds in chips. The researchers came up with a design that uses water as the coolant liquid and transfers the water to an … [Read more...]
Embedded Wafer-Level-Packages
Yole Developpement has released its new report on Embedded Wafer-Level-Packaging. This analysis covers both Fan-Out WLP technology development and Chip embedding into PCB laminated substrates. These two infrastructures are emerging at the same time and ramping to high volume production. Key features of the report “Embedded Wafer-Level-Packages: Fan-out WLP / Chip Embedding in … [Read more...]
Eaton Brings On-board Enclosure to Data Centers
Industrial conglomerate Eaton Corp has agreed to buy Wright Line Holding Inc., a privately held maker of enclosures and racks for electronics for data centers, Eaton said on Wednesday. Terms were not disclosed. Wright Line recorded sales of about $101 million over the past year. Eaton’s electrical segment makes power distribution technology and uninterruptible power systems, … [Read more...]
ACT Launches Technical Services Business Group
Advanced Cooling Technologies, Inc. (ACT) launched a new Technical Services business group, which offers a range of thermal engineering services to a wide variety of private and government organizations. These services range from initial concept generation to product design to delivery of a complete procurement package for a qualified thermal solution, and everything … [Read more...]
Six Cool Innovations for the Data Center
Computing industry veteran John Brandon explains six new products and technologies that promise to solve real data centre problems or are already working to make enterprise operations run more smoothly. They include fiber optics with a twist, submerged liquid cooling and horizontal racks; several broadband lines combined into one; multiple data centers more easily connected; … [Read more...]
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