The recent discovery of a new magnetocaloric material with intriguing characteristics could lead to a greener method of cooling, potentially providing a more environmentally-friendly alternative to standard refrigeration. A joint team of researchers from Canada and Bulgaria have developed a new method of green cooling by identifying a multiferroic compound, HoMn2O5, that could … [Read more...]
Rugged Circuit Functions at Temperatures Greater than 350 Degrees Celsius
Researchers at the University of Arkansas have developed integrated circuits capable of surviving at temperatures greater than 350 degrees Celsius, or approximately 660 degrees Fahrenheit. Created using silicon carbide, a semiconducting material that is more rugged than conventional materials used in electronics, the new circuits are expected to improve the operation of analog … [Read more...]
Neural Network Boosts Google Data Center Efficiency
In its quest for ever-greater energy efficiency, Google is now employing a new technique that adds a bit of artificial intelligence to its data centers: machine learning. The web giant is using what it calls “neural networks” to optimize its data center operations by monitoring how its servers behave in real-time and adjusting certain parameters accordingly. The project, … [Read more...]
Controlling Thermal Conductivity to Improve Energy Storage
Researchers at the University of Illinois at Urbana-Champaign have experimentally shown for the first time that the thermal conductivity of lithium cobalt oxide (LixCoO2), a material used in the cathodes of lithium-ion batteries, can be reversibly electrochemically modulated over a significant range. Many technologies require control over the flow of heat through materials in … [Read more...]
New Thermal Interface Protocol Standard for 3D-ICs
The Silicon Integration Initiative (Si2) has announced the release of a new chip thermal interface protocol (CTIP) standard for three-dimensional integrated circuits (3D-IC) under the auspices of the Open3D Technical Advisory Board (TAB). The Open3D TAB is chartered to define open standards for design data formats and interfaces to enable interoperable 2.5D and 3D design … [Read more...]
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