Northwestern University researchers are investigating the possibility of vertical heat transport for better cooling devices. A new paper published in Physical Review Letters by researchers at Northwestern University in Illinois explores the idea of using materials in which heat flows perpendicular to an electric current to develop better devices for cooling … [Read more...]
Micro-Vacuum Technology May Cool Future Smartphone Processors
Researchers from the University of Michigan, Massachusetts Institute of Technology (MIT) and Honeywell International, Inc. have developed microscale vacuum pumps that could lead to tiny, more efficient cooling systems for faster processors in smartphones. Developed as part of DARPA’s Chip-Scale Vacuum Micro Pumps (CSVMP) program, the new microscale vacuum pumps are intended … [Read more...]
Electronics Cooling Announces New Editor
Electronics Cooling is proud to announce the addition of Peter Rodgers to the technical board. Rodgers is currently an associate professor of mechanical engineering at The Petroleum Institute, Abu Dhabi, UAE. He previously worked at the University of Maryland; Nokia (Finland); Electronics Thermal Management, Ltd. (Ireland), and the University of Limerick (Ireland). He is a … [Read more...]
Manufacturing Plant for Nanoceramic-Aluminum Substrate Technology to Be Built in Haverhill
Electronics thermal management provider Cambridge Nanotherm has announced plans to build its first prototype manufacturing plant in Haverhill, UK following the award of £250,000 in matched funding from the UK Innovation Agency - Technology Strategy Board (TSB). The company plans to use the new facility to further develop its new nanoceramic-aluminum substrate technology, and to … [Read more...]
DuPont Increases Thermal Substrate Production to Accommodate Demand
DuPont Circuit & Packaging Materials, part of DuPont Electronics & Communications, announced earlier this week that it has increased production at its Hsinchu, Taiwan facility by more than seven times the previous amount to better accommodate demand for its CooLam thermal substrate products. DuPont CooLam thermal substrates are designed to help dissipate heat in LED … [Read more...]
- « Previous Page
- 1
- …
- 53
- 54
- 55
- 56
- 57
- …
- 126
- Next Page »