Asetek, a developer of energy efficient liquid cooling systems for data centers, servers and high performance PCs, has announced the issuance of two new patents. Issued by the U.S. Patent Office, patent no. 8,358,505 covers technology used for liquid cooling of “small form factor computing devices,” including laptops and blade servers. Patent no. 2005800500092, issued by the … [Read more...]
Microsoft to Expand Hybrid Indoor-Outdoor “Roofless” Data Center
Microsoft has announced that the company’s newest data center campus will be expanded to include two more data center facilities. Located in Boydton, Va., the facility houses server racks both indoors and outdoors within larger enclosures as part of a hybrid design engineered to reduce operating costs and increase energy efficiency. The new expansion will bring the data … [Read more...]
Laird Technologies Acquires Thermoelectric Technology Developer Nextreme Thermal Solutions
Laird Technologies, a developer of components and solutions for electromagnetic interference protection and thermal protection of electronics, has announced the acquisition of U.S.-based manufacturer of thin-film thermoelectric technologies Nextreme Thermal Solutions. Though Nextreme and Laird currently have a strategic design and distribution partnership, the acquisition will … [Read more...]
New Magnetic Cooling Technology Decreases Environmental Impact of Cooling, Avoids Side Effects of Magnetic Fields on Electronics
Researchers from the University of Cambridge, U.K. and CIC nanoGUNE in Spain have developed a new cooling technology for the thermal management of computer chips and other miniaturized devices that utilizes materials that change their temperature when exposed to magnetic fields. Materials measuring only 20 nm tick and comprised of comprised of lanthanum, calcium, manganese and … [Read more...]
“What Burns Me Up”: Follow Up to SEMI-THERM Executive Briefing
On Mar. 27, 2013, Roger Stout, P.E. of ON Semiconductor will present a live webinar, “SEMI-THERM Executive Briefing - "What Burns Me Up." Thermal errors, misconceptions and oversights occur on all levels; from semiconductor packaging, thermocouple theory, and infrared imaging; to cold fusion calorimetry and hot dense-plasma-focus fusion reactor design; to energy efficient … [Read more...]
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